Secondary operations

Submitted by biomerics_dev on Tue, 09/17/2024 - 07:43
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<p><span>While the MIM process reduces the need for many secondary operations, some specialized components may require one or more of the following operations, all of which we can provide to you:</span></p>

<ul class="custom-list" style="--bullet-bg-color:#29A7DF;">
<li>Coining</li>
<li>Magnetic polishing</li>
<li>Electropolishing</li>
<li>Machining</li>
<li>Heat treating</li>
<li>Plating/coating</li>
<li>Tapping/reaming</li>
<li>Black oxide coating</li>
<li>Tumbling</li>
<li>Bead blasting</li>
<li>Hot isostatic pressing (HIP)</li>
</ul>
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